Odisha
India’s first advanced 3D glass chip packaging unit has been launched in Bhubaneswar, marking a major step in the country’s push toward high-tech manufacturing and semiconductor innovation
Updated 5 hours ago

An Improvised Explosive Device (IED) and related material were seized during the operation, police said
Updated 1 day ago
Four planning attacks at top Indian spots nabbed by Delhi Police
Updated 1 day ago
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Four held for abducting student for ransom in BTM layout
Updated 6 days ago
Sharad Pawar, Ramdas Athawale among 19 Rajya Sabha members to take oath
Updated 14 days ago

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