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India’s first advanced 3D glass chip packaging unit has been launched in Bhubaneswar, marking a major step in the country’s push toward high-tech manufacturing and semiconductor innovation

Updated 5 hours ago

The glass chip unit was unveiled in Odisha. Pic/PTI

An Improvised Explosive Device (IED) and related material were seized during the operation, police said

Updated 1 day ago

The glass chip unit was unveiled in Odisha. Pic/PTI
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